LOCTITE ECCOBOND FP4323

LOCTITE ECCOBOND FP4323, Epoxy, Encapsulant - glob top LOCTITE® ECCOBOND FP4323 is a high purity liquid epoxy encapsulant for chip on board (plastic substrate) and plastic PGA applications. It is designed with flow capabilities that allows encapsulation without flowing beyond the chip.

• Low CTE for improved thermal cycling
• Thixotropic
• High purity
• Excellent moisture resistance