LOCTITE ECCOBOND FP4410HF

Low stress fill for potting automated sensor and diodes, high Tg. LOCTITE® ECCOBOND FP0087 yields best results when used to encapsulate a device enclosed in a cavity or potting ring, which restricts the flow of the material. The unique combinationof low stress and excellent resistance to moisture and process fluids provide excellent results in severe automotive environments.