LOCTITE ECCOBOND FP4470

LOCTITE ECCOBOND FP4470, Epoxy, Encapsulant LOCTITE® ECCOBOND FP4470 features excellent flow properties allowing the material to penetrate fine pitch wires and deep cavities without entrapping voids. This product can withstand solder reflow after being exposed to JEDEC Level 2A (60°C/60% RH, 120 hours) preconditioning. LOCTITE ECCOBOND FP4470 is a high adhesion version of FP4450 for 260°C L3 JEDEC performance.

• High purity
• 260°C reflow capability for Pb-free applications
• Green product
• Excellent flow properties

Coefficient of Thermal Expansion (CTE), Above Tg	65.0 ppm/°C
Coefficient of Thermal Expansion (CTE), Below Tg	18.0 ppm/°C
Color	Black
Cure Schedule, Alternate @ 165.0 °C	90.0 min.
Cure Schedule, Recommended @ 125.0 °C	30.0 min.
Cure Type	Heat Cure
Dielectric Constant, @ 1kHz	3.5
Glass Transition Temperature (Tg)	148.0 °C
Operating Temperature	-65.0 - 150.0 °C
Specific Gravity, @ 25.0 °C	1.8
Viscosity, Brookfield - RVF, @ 25.0 °C Spindle 6, speed 10 rpm	42000.0 mPa·s (cP)
Volume Resistivity	5x10¹⁶ Ohm cm