LOCTITE ECCOBOND LA 3032-78

LOCTITE ECCOBOND LA 3032-78, Chemically resistant, Epoxy, Encapsulant LOCTITE® ECCOBOND LA 3032-78 encapsulant is designed for high throughput assembly operations. It is formulated to withstand high heat distortion temperatures and bonds well to engineering plastics

• One component
• Fast cure at low temperatures
• Excellent chemical resistance

Casson Viscosity, Cone diameter 2 cm, Angle 2° Shear Rate 50 s⁻¹	500000.0 mPa·s (cP)
Cure Schedule, @ 100.0 °C	15.0 min.
Cure Schedule, @ 120.0 °C	3.0 min.
Glass Transition Temperature (Tg)	110.0 °C
Storage Modulus, @ 25.0 °C Ramp Rate 3 °C/min., 1 Hz, 10μm	3700.0 N/mm² (536639.0 psi )
Thixotropic Index	6.5