LOCTITE ECCOBOND UF 3800

LOCTITE ECCOBOND UF 3800, Epoxy, Underfill LOCTITE® ECCOBOND UF 3800 reworkable epoxy underfill is designed for CSP and BGA applications. It cures quickly at moderate temperatures to minimize stress to other components, and when cured provides excellent mechanical stress protection for solder joints.

• Reworkable
• High Tg
• Room temperature flow capability
• Fast cure at moderate temperatures

Coefficient of Thermal Expansion (CTE), Above Tg	188.0 ppm/°C
Coefficient of Thermal Expansion (CTE), Below Tg	52.0 ppm/°C
Cure Schedule, @ 130.0 °C	8.0 min.
Glass Transition Temperature (Tg)	69.0 °C
Viscosity, Physica MCR100 @ 25.0 °C Spindle CP50-1	375.0 mPa·s (cP)