LOCTITE ECCOBOND UF 8830S

LOCTITE ECCOBOND UF 8830S liquid epoxy underfill encapsulant is formulated for tight bump pitch and narrow gap in flip chip BGA applications. It is designed to improve crack/fracture resistance and deliver faster flow. LOCTITE® ECCOBOND UF 8830S liquid epoxy underfill encapsulant is formulated for tight bump pitch and narrow gap in flip chip BGA applications. It is designed to improve crack/fracture resistance and deliver faster flow. When fully cured, this material forms a rigid, low stress seal that dissipates stress in solder joints and extends thermal cycling performance.

• Improved toughness
• Low CTE
• High purity
• High TG

Coefficient of Thermal Expansion (CTE), Above Tg	100.0 ppm/°C
Coefficient of Thermal Expansion (CTE), Below Tg	25.0 ppm/°C
Glass Transition Temperature (Tg)	118.0 °C
Storage Modulus, DMA @ 25.0 °C	11500.0 N/mm² (1667934.0 psi )
Storage Temperature	-40.0 °C
Viscosity, Brookfield, @ 25.0 °C Spindle 51, Speed 5 rpm	22120.0 mPa·s (cP)