LOCTITE ABLESTIK 5025E

LOCTITE ABLESTIK 5025E is a silver, epoxy film adhesive that is particularly suited for bonding “hot” devices onto heat sinks in applications where electrical insulation is not required. LOCTITE® ABLESTIK 5025E is a silver filled, thin material that offers uniform bondline control and excellent thermal and electrical conductivity. Typically used for microwave circuitry and heat sink attach applications. This product provides RF/EMI shielding and passes NASA outgassing standards as well as meets MIL-STD-883, Method 5011 requirements.

• Thin, uniform bondline control
• Silver-filled
• RF/EMI shielding
• Electrically conductive in x,y, and z axes

Agency Approvals / Certificates / Specifications	MIL Standard 883, Method 5011
Cure Schedule, @ 150.0 °C	30.0 min.
Cure Type	Heat Cure
Glass Transition Temperature (Tg)	90.0 °C
Physical Form	Film
Shear Strength, Aluminum	2000.0 psi
Technology	Epoxy
Thermal Conductivity	6.5 W/mK