LOCTITE ABLESTIK 508

LOCTITE ABLESTIK 508, Epoxy Film, Assembly, Thermoplastic Adhesive LOCTITE® ABLESTIK 508 thermoplastic adhesive is designed to provide a temporary bond in ceramic chip or ferrite dicing applications. Parts bonded with LOCTITE ABLESTIK 508 adhesive film may be separated by reheating or immersion in a solvent such as acetone, MEK, or tetrahydrofuran

• Reworkable

Cure Schedule, @ 125.0 °C	15.0 min.
Cure Type	Heat Cure
Physical Form	Film
Shear Strength, Aluminum	4003.0 psi
Technology	Epoxy