LOCTITE ABLESTIK 550 Így ismerik: Ablestik ABLEFILM 550

LOCTITE ABLESTIK 550, Epoxy Film, Assembly LOCTITE® ABLESTIK 550 adhesive film is designed for substrate attach and sealing microelectronic packages. This adhesive film gives off methanol, water, and ammonia during cure. Using LOCTITE ABLESTIK 550 adhesive in hermetically sealed packages is not recommended.

• Thermally conductive

Cure Schedule, @ 150.0 °C	30.0 min.
Cure Type	Heat Cure
Dielectric Constant, @ 1kHz	4.8
Glass Transition Temperature (Tg)	105.0 °C
Physical Form	Film
Shear Strength, Aluminum	5700.0 psi
Technology	Epoxy
Thermal Conductivity	0.2 W/mK