LOCTITE ABLESTIK 550K Így ismerik: Ablestik ABLEFILM 550K

LOCTITE ABLESTIK 550K, Epoxy Film, Assembly LOCTITE® ABLESTIK 550K is designed for substrate attach and heat sink bonding

• Low cure temperature
• High thermal conductivity
• Suitable for an array of difficult-to-bond substrates

Cure Schedule, @ 150.0 °C	30.0 min.
Cure Type	Heat Cure
Dielectric Constant, @ 1kHz	5.7
Glass Transition Temperature (Tg)	102.0 °C
Physical Form	Film
Shear Strength, Aluminum	3300.0 psi
Technology	Epoxy
Thermal Conductivity	0.8 W/mK