LOCTITE ABLESTIK 561 Így ismerik: ABLESTIK ABLEFILM 561

LOCTITE ABLESTIK 561, Epoxy Film, Assembly LOCTITE® ABLESTIK 561 is designed for bonding materials with mismatched coefficients of thermal expansion. In many bonding applications, components may be repaired. Component joined with LOCTITE ABLESTIK 561 adhesive can be debonded by heating the assembly to 150°C and sliding a thin blade, such as a razor blade, between the bonded surfaces. This adhesive is also available in a low temperature cure version.

• Thermally conductive : 2.0 W/m-K
• Reworkable
• Flexible

Cure Schedule, @ 150.0 °C	30.0 min.
Cure Type	Heat Cure
Dielectric Constant, @ 1kHz	7.0
Glass Transition Temperature (Tg)	50.0 °C
Physical Form	Film
Shear Strength, Aluminum	1600.0 psi
Technology	Epoxy
Thermal Conductivity	0.3 W/mK