LOCTITE ABLESTIK 561K

LOCTITE ABLESTIK 561K, Epoxy Film, Assembly LOCTITE® ABLESTIK 561K is designed for substrate attach and heat sink bonding. This adhesive film is designed for bonding materials with severely mismatched coefficients of thermal expansion. All data and results will vary with different thicknesses.

• Flexible for Bonding Mismatched Adherents
• Reworkable
• Thermally conductive
• Electrically insulating film manages applications where CTE mismatch is an issue
• High strength

Carrier Type	Glass fabric
Cure Schedule, @ 150.0 °C	30.0 min.
Cure Type	Heat Cure
Dielectric Constant, @ 1kHz	5.7
Glass Transition Temperature (Tg)	55.0 °C
Physical Form	Film
Shear Strength, Aluminum	3300.0 psi
Technology	Epoxy
Thermal Conductivity	0.9 W/mK