LOCTITE ABLESTIK 561KAP

LOCTITE ABLESTIK 561KAP, Epoxy Film, Component assembly, Assembly film LOCTITE® ABLESTIK 561KAP is designed for bonding materials with mismatched coefficients of thermal expansion. In many bonding applications, components may be repaired. Component joined with LOCTITE ABLESTIK 561KAP adhesive can be debonded by heating the assembly to 150°C and sliding a thin blade, such as a razor blade, between the bonded surfaces.

• Flexible
• Reworkable
• Resilient bonds between materials with mismatched CTEs

Carrier Type	Polyimide
Cure Schedule, @ 125.0 °C	2.0 hr.
Cure Type	Heat Cure
Physical Form	Film
Shear Strength, Aluminum	1800.0 psi
Technology	Epoxy