LOCTITE ABLESTIK 566

LOCTITE ABLESTIK 566, Epoxy Film, Assembly LOCTITE ABLESTIK 566 is designed for bonding materials with mismatched coefficients of thermal expansion. This material is the low temperature curing version of LOCTITE ABLESTIK 561 adhesive.

• Electrically Insulating
• Flexible
• Low temperature cure

Carrier Film Thickness	1.0 mil
Carrier Type	Glass fabric
Cure Schedule, @ 90.0 °C	3.0 hr.
Cure Type	Heat Cure
Glass Transition Temperature (Tg)	45.0 °C
Physical Form	Film
Shear Strength, Aluminum	1800.0 psi
Technology	Epoxy