LOCTITE ABLESTIK 5662

LOCTITE ABLESTIK 5662, Epoxy Film, Assembly LOCTITE® ABLESTIK 5662 epoxy adhesive is specially designed for applications where both flexibility and good adhesion are required. LOCTITE ABLESTIK 5662 adhesive is particularly useful in applications requiring good insulation between two substrates, such as bonding PC boards with solder bumps to heat sinks. This adhesive is also suitable for bonding materials with mismatched coefficients of thermal expansion.

• Low temperature cure
• Flexible
• Good adhesion

Carrier Film Thickness	2.0 mil
Carrier Type	Kapton
Cure Schedule, @ 90.0 °C	3.0 hr.
Cure Type	Heat Cure
Glass Transition Temperature (Tg)	100.0 °C
Physical Form	Film
Shear Strength, Aluminum	2300.0 psi
Technology	Epoxy
Thermal Conductivity	0.2 W/mK