LOCTITE ABLESTIK ECF 550

LOCTITE ABLESTIK ECF 550, Epoxy Film, Assembly LOCTITE® ABLESTIK ECF 550 adhesive is designed for microelectronic applications which require electrical conductivity. When used for substrate attach, this adhesive film acts as an electrical ground plane. In the assembly and sealing of microelectronic packages which require RF shielding, LOCTITE ABLESTIK ECF 550 film adhesive maintains electrical continuity between joints.

• Electrically conductive
• Moisture resistant

Carrier Film Thickness	1.0 mil
Carrier Type	Glass fabric
Cure Schedule, @ 150.0 °C	30.0 min.
Cure Type	Heat Cure
Glass Transition Temperature (Tg)	81.0 °C
Physical Form	Film
Shear Strength, Aluminum	20.0 psi
Technology	Epoxy
Thermal Conductivity	1.0 W/mK