LOCTITE ABLESTIK ECF 568 Így ismerik: Ablestik ABLEFILM ECF568

LOCTITE ABLESTIK ECF 568, Epoxy Film, Assembly LOCTITE® ABLESTIK ECF 568 high purity adhesive is designed for substrate attach. This material is a low temperature cure version of ABLEFILM 550 adhesive.

• Electrically conductive
• Low temperature cure
• High purity
• Adheres well to a variety of substrates

Cure Schedule, @ 95.0 °C	2.0 hr.
Cure Type	Heat Cure
Glass Transition Temperature (Tg)	113.0 °C
Physical Form	Film
Shear Strength, Aluminum	5100.0 psi
Technology	Epoxy