LOCTITE ECCOBOND FP4451

LOCTITE ECCOBOND FP4451, Epoxy, Encapsulant - dam LOCTITE® ECCOBOND FP4451 damming material is designed as a flow control barrier around areas of bare chip encapsulation. LOCTITE ECCOBOND FP4451 used in combination with FP4450, LOCTITE ECCOBOND FP4451 and other Henkel encapsulants passes pressure pot performance on live devices up to 500 hours with no failures depending on device and package type. Please refer to the TDS for alternate cure schedules.

• High purity
• Green product
• Minimal slumping

Coefficient of Thermal Expansion (CTE), Below Tg	22.0 ppm/°C
Color	Black
Cure Schedule, Alternate @ 165.0 °C	90.0 min.
Cure Schedule, Recommended @ 125.0 °C	30.0 min.
Cure Type	Heat Cure
Filler	71.0 %
Glass Transition Temperature (Tg)	155.0 °C
Operating Temperature	-65.0 - 150.0 °C
Specific Gravity, @ 25.0 °C	1.76
Storage Temperature	-40.0 °C
Viscosity, Brookfield - RVT, @ 25.0 °C Spindle 7, speed 4 rpm	860000.0 mPa·s (cP)