LOCTITE ABLESTIK 2000 Így ismerik: ABLEBOND 2000 (3.6G)

LOCTITE ABLESTIK 2000, Proprietary Hybrid Chemistry, Electrically Conductive Die Attach Adhesive LOCTITE® ABLESTIK 2000 electrically conductive die attach adhesive is designed for Pb-free PBGA and Array BGA packaging. This product is able to withstand the high reflow temperatures necessary for Pb-free solders @ 260°C. It is suitable for die sizes up to 12.7 x 12.7 mm.

• Proprietary hybrid chemistry
• Pb-free applications
• Ultra-low moisture absorption
• High hot/wet adhesion

Applications	Die Attach
Coefficient of Thermal Expansion (CTE)	65.0 ppm/°C
Cure Type	Heat Cure
Extractable Ionic Content, Chloride (CI-)	1.0 ppm
Extractable Ionic Content, Potassium (K+)	1.0 ppm
Extractable Ionic Content, Sodium (Na+)	1.0 ppm
Hot Die Shear Strength	8.0 kg-f
RT Die Shear Strength	16.0 kg-f
Tensile Modulus, DMTA @ 250.0 °C	193.0 N/mm² (28000.0 psi )