LOCTITE ABLESTIK 2025D Így ismerik: ABLEBOND 2025D (14G)

LOCTITE ABLESTIK 2025D is a red, proprietary hybrid chemistry die attach adhesive designed for use in array packaging. LOCTITE® ABLESTIK 2025D is a non-conductive, heat curing, die attach adhesive that exhibits minimal bleed and good adhesion to many different substrates. With excellent hot/wet die shear strength and 260°C reflow capability for Pb-free applications, this product is typically used in PBGA, FlexBGA, and Stacking BGA package applications.

• Good adhesion to a variety of substrates
• High hot/wet die shear strength
• Minimum bleed
• 260°C reflow capability for Pb-free applications

Applications	Die Attach
Coefficient of Thermal Expansion (CTE)	48.0 ppm/°C
Coefficient of Thermal Expansion (CTE), Above Tg	140.0 ppm/°C
Cure Type	Heat Cure
Extractable Ionic Content, Chloride (CI-)	9.0 ppm
Extractable Ionic Content, Potassium (K+)	9.0 ppm
Extractable Ionic Content, Sodium (Na+)	9.0 ppm
Hot Die Shear Strength	3.5 kg-f
RT Die Shear Strength	20.0 kg-f
Tensile Modulus, @ 250.0 °C	116.0 N/mm² (16800.0 psi )
Thermal Conductivity	0.4 W/mK
Thixotropic Index	4.4
Viscosity, Brookfield CP51, @ 25.0 °C Speed 5 rpm	11500.0 mPa·s (cP)