LOCTITE ABLESTIK 2033SC Így ismerik: ABLEBOND 2033SC (13G)

LOCTITE ABLESTIK 2033SC, Proprietary Hybrid Chemistry, Die Attach LOCTITE® ABLESTIK 2033SC die attach adhesive is designed for high throughput smart card bonding applications. It is compatible with various encapsulant chemistries.

• Non-conductive
• Single component
• Long work life
• Low bleed

Applications	Die Attach
Coefficient of Thermal Expansion (CTE)	56.0 ppm/°C
Coefficient of Thermal Expansion (CTE), Above Tg	133.0 ppm/°C
Cure Schedule, Alternate 2 @ 150.0 °C	10.0 sec.
Cure Schedule, Alternate @ 120.0 °C	60.0 sec.
Cure Schedule, Recommended @ 110.0 °C	90.0 sec.
Cure Type	Heat Cure
Extractable Ionic Content, Chloride (CI-)	29.0 ppm
Extractable Ionic Content, Potassium (K+)	4.0 ppm
Extractable Ionic Content, Sodium (Na+)	14.0 ppm
Glass Transition Temperature (Tg)	46.0 °C
Key Characteristics	Cure Speed: Fast Cure, Stress: Low Stress
Tensile Modulus, DMTA @ 200.0 °C	60.0 N/mm² (8600.0 psi )
Thixotropic Index	6.1
Viscosity, Brookfield CP51, @ 25.0 °C Speed 5 rpm	11300.0 mPa·s (cP)