LOCTITE ABLESTIK 2035SC-1B1 Így ismerik: ABLEBOND 2035SC-1B1 (14G)

LOCTITE ABLESTIK 2035SC-1B1, Acrylate, Die Attach, Non-Conductive Adhesive LOCTITE® ABLESTIK 2035SC-1B1 non-conductive die attach adhesive has been formulated for use in high throughput die attach applications. It is designed for die attach applications requiring good dielectric layer. This material is designed to minimize stress and resulting warpage between dissimilar surfaces. LOCTITE ABLESTIK 2035SC-1B1 adhesive is the 20?m bondline control version of ABLEBOND 2035SC adhesive.

• Non-conductive
• Single component
• Low cure temperature
• Fast cure

Application Method	Dispense System
Applications	Die Attach
Coefficient of Thermal Expansion (CTE)	54.0 ppm/°C
Coefficient of Thermal Expansion (CTE), Above Tg	128.0 ppm/°C
Color	Red
Cure Type	Heat Cure
Glass Transition Temperature (Tg)	120.0 °C
Hot Die Shear Strength, @ 150.0 °C 1.3 x 1.3 mm Si die on PBGA	1.11 kg-f
Key Characteristics	Conductivity: Electrically Non-Conductive, Cure Speed: Fast Cure, Stress: Low Stress
Number of Components	1 Part
Physical Form	Paste
RT Die Shear Strength, 1.3 x 1.3 mm Si die on PBGA	3.81 kg-f
Substrates	Laminate
Technology	Acrylate
Thermal Conductivity	0.35 W/mK
Thixotropic Index	4.3
Viscosity, Brookfield CP51, @ 25.0 °C Speed 5 rpm	11000.0 mPa·s (cP)