Product details from catalogue Inquiry

Drawings:

LOCTITE ABLESTIK 2053S Így ismerik: ABLEBOND 2053S (10G)

LOCTITE ABLESTIK 2053S, Epoxy, Die Attach LOCTITE® ABLESTIK 2053S die attach adhesive is designed for use in array packaging.
  • Low stress
  • Non-conductive

Applications Die Attach
Coefficient of Thermal Expansion (CTE) 149.0 ppm/°C
Coefficient of Thermal Expansion (CTE), Above Tg 216.0 ppm/°C
Cure Type Heat Cure
Extractable Ionic Content, Chloride (CI-) 9.0 ppm
Extractable Ionic Content, Potassium (K+) 9.0 ppm
Extractable Ionic Content, Sodium (Na+) 9.0 ppm
Glass Transition Temperature (Tg) -21.0 °C
Hot Die Shear Strength 2.1 kg-f
RT Die Shear Strength 6.0 kg-f
Tensile Modulus, @ 250.0 °C 22.0 N/mm² (3200.0 psi )
Thixotropic Index 2.5
Viscosity, Brookfield CP51, @ 25.0 °C Speed 5 rpm 130000.0 mPa·s (cP)