LOCTITE ABLESTIK 2100A Így ismerik: ABLEBOND 2100A (34G)

LOCTITE ABLESTIK 2100A, Proprietary Hybrid Chemistry, Die Attach LOCTITE® ABLESTIK 2100A die attach adhesive is designed for Pb-free array packaging. This product is able to withstand the high reflow temperatures necessary for Pb-free solders @ 260°C. It is suitable for die sizes up to 12.7 x 12.7 mm.

• High hot/wet adhesion
• Ultra-low moisture absorption
• Low stress
• Pb-free applications

Applications	Die Attach
Coefficient of Thermal Expansion (CTE)	65.0 ppm/°C
Cure Type	Heat Cure
Extractable Ionic Content, Chloride (CI-)	9.0 ppm
Extractable Ionic Content, Potassium (K+)	9.0 ppm
Extractable Ionic Content, Sodium (Na+)	9.0 ppm
Hot Die Shear Strength	5.0 kg-f
RT Die Shear Strength	16.0 kg-f
Tensile Modulus, DMTA @ 250.0 °C	234.0 N/mm² (34000.0 psi )
Tensile Modulus, DMTA @ 65.0 °C	3172.0 N/mm² (460000.0 psi )