LOCTITE ABLESTIK 2300 Így ismerik: ABLEBOND 2300

LOCTITE ABLESTIK 2300, Proprietary Hybrid Chemistry, Die Attach LOCTITE® ABLESTIK 2300 electrically conductive adhesive is designed for Pb-free PBGA and Array BGA packaging. This product is able to withstand the high reflow temperatures necessary for Pb-free solders @ 260°C. This adhesive is also designed for ease of manufacturing.

• High hot/wet adhesion
• Ultra-low moisture absorption
• Low stress
• Fast cure with no voids

Applications	Die Attach
Coefficient of Thermal Expansion (CTE)	60.0 ppm/°C
Cure Type	Heat Cure
Extractable Ionic Content, Chloride (CI-)	9.0 ppm
Extractable Ionic Content, Potassium (K+)	9.0 ppm
Extractable Ionic Content, Sodium (Na+)	9.0 ppm
Hot Die Shear Strength	9.2 kg-f
RT Die Shear Strength	13.2 kg-f
Tensile Modulus, @ 250.0 °C	234.0 N/mm² (34000.0 psi )