LOCTITE ABLESTIK 2600BT

LOCTITE ABLESTIK 2600BT, Thermal Management, Die Attach LOCTITE® ABLESTIK 2600BT adhesive is designed for thermal management applications requiring high heat extraction from the die. This adhesive uses a unique suspension system containing silver and resin particles suspended in solvent carrier. Once the material is fully cured and the solvent is evaporated, the adhesive has an extremely high silver loading. LOCTITE ABLESTIK 2600BT adhesive provides very low thermal resistance between chip to case, nearing solder and eutectic-type materials.

• High thermal conductivity
• Improved spreadability
• Improved dispensability
• Yields consistent dot sizes with minimal or no tailing

Applications	Die Attach
Coefficient of Thermal Expansion (CTE)	40.0 ppm/°C
Cure Type	Heat Cure
Extractable Ionic Content, Chloride (CI-)	9.0 ppm
Extractable Ionic Content, Potassium (K+)	5.0 ppm
Extractable Ionic Content, Sodium (Na+)	9.0 ppm
Hot Die Shear Strength	1.4 kg-f
RT Die Shear Strength	10.0 kg-f