LOCTITE ABLESTIK 2600K

LOCTITE ABLESTIK 2600K, Thermal Management, Die Attach, Electrically Conductive Adhesive LOCTITE® ABLESTIK 2600K adhesive is designed for thermal management applications requiring high heat extraction from the die. This adhesive uses a unique suspension system containing silver, thermoplastic and thermoset resin particles suspended in a solvent carrier. Once the material is fully cured and the solvent is evaporated, the adhesive has an extremely high silver loading. LOCTITE ABLESTIK 2600K adhesive provides very low thermal resistance between chip to case, nearing solder and eutectic-type materials.

• High thermal conductivity
• Good dispensability
• Low moisture uptake
• Thin bondline

Applications	Die Attach
Coefficient of Thermal Expansion (CTE)	36.0 ppm/°C
Cure Type	Heat Cure
Extractable Ionic Content, Chloride (CI-)	9.0 ppm
Extractable Ionic Content, Potassium (K+)	5.0 ppm
Extractable Ionic Content, Sodium (Na+)	9.0 ppm
Hot Die Shear Strength	1.0 kg-f
RT Die Shear Strength	8.3 kg-f