LOCTITE ABLESTIK 2815A

LOCTITE ABLESTIK 2815A, Acrylate, Die Attach LOCTITE® ABLESTIK 2815A die attach adhesive is designed to minimize thermal resistance between the chip and substrate. It provides improved workability for applications requiring high heat extraction from die.

• Electrically conductive
• Thermally conductive
• Good fillet formation
• Good dispensability

Applications	Die Attach
Coefficient of Thermal Expansion (CTE)	64.0 ppm/°C
Cure Type	Heat Cure
Extractable Ionic Content, Chloride (CI-)	19.0 ppm
Extractable Ionic Content, Potassium (K+)	9.0 ppm
Extractable Ionic Content, Sodium (Na+)	19.0 ppm
RT Die Shear Strength	5.8 kg-f
Tensile Modulus, @ 250.0 °C	1600.0 N/mm² (230000.0 psi )