LOCTITE ABLESTIK 6202C

LOCTITE ABLESTIK 6202C, Proprietary Hybrid Chemistry, Low Modulus, Die Attach Adhesive LOCTITE® ABLESTIK 6202C B-stageable adhesive is ideal for chip scale packages where tolerance and bleed need to be minimized. This low modulus adhesive is recommended for large die sizes.

• Low flow (<150µm)
• Stencil printing
• Low moisture uptake
• Low warpage

Applications	Die Attach
Coefficient of Thermal Expansion (CTE)	70.0 ppm/°C
Coefficient of Thermal Expansion (CTE), Above Tg	350.0 ppm/°C
Cure Type	Heat Cure
Density, Maximum Final	1.1 g/cm³
Extractable Ionic Content, Chloride (CI-)	24.0 ppm
Extractable Ionic Content, Potassium (K+)	19.0 ppm
Extractable Ionic Content, Sodium (Na+)	19.0 ppm
Glass Transition Temperature (Tg)	40.0 °C
Hot Die Shear Strength	1.1 kg-f
RT Die Shear Strength	10.4 kg-f
Tensile Modulus, @ 250.0 °C	6.0 N/mm² (812.0 psi )
Thixotropic Index	2.3
Viscosity, Brookfield CP51, @ 25.0 °C Speed 5 rpm	28000.0 mPa·s (cP)