Applications |
Die Attach |
Coefficient of Thermal Expansion (CTE) |
70.0 ppm/°C |
Coefficient of Thermal Expansion (CTE), Above Tg |
232.0 ppm/°C |
Cure Type |
Heat Cure |
Density, Maximum Final |
1.1 g/cm³ |
Extractable Ionic Content, Chloride (CI-) |
25.0 ppm |
Extractable Ionic Content, Potassium (K+) |
10.0 ppm |
Extractable Ionic Content, Sodium (Na+) |
25.0 ppm |
Glass Transition Temperature (Tg) |
40.0 °C |
Hot Die Shear Strength |
1.0 kg-f |
RT Die Shear Strength |
10.0 kg-f |
Tensile Modulus, DMTA @ 250.0 °C |
6.0 N/mm² (812.0 psi ) |
Thixotropic Index |
2.5 |
Viscosity, Brookfield CP51, @ 25.0 °C Speed 5 rpm |
30000.0 mPa·s (cP) |