LOCTITE ABLESTIK 8006NS

LOCTITE ABLESTIK 8006NS, Epoxy, Non-conductive, Die Attach Adhesive LOCTITE® ABLESTIK 8006NS non-conductive die attach adhesive has been formulated for use in high throughput die attach applications. This product is designed for application by stencil or screen printing. This material can be applied to a wafer backside by stencil printing and then B-staged in an oven. Once B-staged, this adhesive remains stable and can be placed into storage for several months. With proper die bonder setup along with incorporating adequate die placement pressure, a consistent minimum bondline thickness of 1mil can be achieved with minimal die tilt.

• B-Stageable
• Offers improved printability
• Non-conductive
• Engineered to accurately control bondline thickness and die tilt

Application Method	Dispense System
Applications	Die Attach
Color	White
Cure Schedule, @ 160.0 °C	2.0 hr.
Cure Type	Heat Cure
Extractable Ionic Content, Chloride (CI-)	14.0 ppm
Extractable Ionic Content, Potassium (K+)	9.0 ppm
Extractable Ionic Content, Sodium (Na+)	9.0 ppm
Filler Type	Alumina/Silica
Key Characteristics	Conductivity: Electrically Non-Conductive, Printable, Screen Printable
Number of Components	1 Part
Physical Form	Paste
RT Die Shear Strength, 2 x 2 mm Si die on ceramic	13.0 kg-f
Technology	Epoxy
Tensile Modulus, @ 150.0 °C	1196.0 N/mm² (176400.0 psi )
Thermal Conductivity	0.44 W/mK
Thixotropic Index	1.3
Viscosity, Brookfield CP51, @ 25.0 °C Speed 5 rpm	55000.0 mPa·s (cP)
Volume Resistivity	0.43x10¹⁴ Ohm cm