BERGQUIST SIL PAD TSP 1600 Így ismerik: Sil-Pad® 800

BERGQUIST SIL PAD TSP 1600 is a thermally conductive, silicone-based, and highly compliant soft pad material that features minimal thermal resistance and maximum thermal performance. BERGQUIST® SIL PAD TSP 1600 is an electrically insulating material designed for applications that require high thermal performance and low mounting pressures. The fiberglass reinforced material with smooth surface texture is electrically isolating and is ideal for applications that require low mounting pressures.

• Thermal impedance: 0.45°C-in2/W (@50 psi)
• High value material
• Smooth and highly compliant surface
• Electrically isolating

Carrier Film Thickness	0.025 mm
Dielectric Breakdown Voltage	3000.0 Vac
Dielectric Constant, @ 1kHz	6.0
Flame Rating	V-0
Operating Temperature	-60.0 - 180.0 °C
Phase Change Temperature	55.0 °C
Shore Hardness, ASTM D2240 Shore A	91.0
Standard Thickness	0.127 mm
Thermal Conductivity	1.6 W/mK
Thermal Impedance, ASTM D5470 @ 50 psi	0.45 °C-in²/W
Volume Resistivity	1×10 Ohm m