BERGQUIST SIL PAD TSP 1800 Így ismerik: Sil-Pad® 1200

BERGQUIST SIL PAD TSP 1800, Exceptional Performance, Silicone based, Fiberglass-reinforced, Thermally Conductive Elastomeric Material BERGQUIST® SIL PAD TSP 1800 is a silicone based, fiberglass-reinforced thermal interface material featuring a smooth, highly compliant surface. The material features a non-tacky surface for efficient re-positioning and ease of use, as well as an optional adhesive coating. BERGQUIST SIL PAD TSP 1800 exhibits exceptional thermal performance at lower application pressures. The material is ideal for placement between electronic power devices and a heatsink for screw and clip mounted applications.

• Thermal impedance: 0.53°C-in2/W (@50 psi)
• Exceptional thermal performance at lower application pressures
• Superior breakdown voltage and surface "wet out" values
• Smooth and non-tacky on both sides for easy re-positioning, ease of use and assembly error reduction

Carrier Type	Fiberglass
Color	Black
Flame Rating	V-0
Standard Thickness	0.229 - 0.406 mm
Technology	Silicone
Thermal Conductivity	1.8 W/mK