BERGQUIST SIL PAD TSP 3500 Így ismerik: Sil-Pad® 2000

BERGQUIST SIL PAD TSP 3500 is a white, high performance, silicone pad material that is designed for demanding aerospace and commercial applications. BERGQUIST® SIL PAD TSP 3500 is a thermally conductive insulating material that is formulated to maximize both the thermal and dielectric performance of the filler/binder matrix. The conformable material is grease free and reinforced with fiberglass providing high reliability for electronic packaging applications. Typical applications include, power supplies, motor controls, power semiconductors, aerospace, and avionics.

• Thermal impedance: 0.33°C-in2/W at 50 psi
• High thermal conductivity 3.5 W/m-K
• Optimal heat transfer

Carrier Type	Fiberglass
Color	White
Flame Rating	V-0
Operating Temperature	-60.0 - 200.0 °C
Standard Thickness	0.254 - 0.508 mm
Technology	Silicone
Thermal Conductivity	3.5 W/mK