BERGQUIST SIL PAD TSP K1100 Így ismerik: Sil-Pad® K-6

BERGQUIST SIL PAD TSP K1100, Thermally Conductive, The Medium Performance Polyimide-Based Insulator BERGQUIST® SIL PAD® TSP K1100 is a medium performance, film-based thermally conductive insulator. The film is coated with a silicone elastomer to deliver high performance and provide a continuous, physically strong dielectric barrier against “cut-through” and resultant assembly failures.Options and ConfigurationsConfiguration - 12" x 12" sheets, 12" x 250 rolls or custom configurationAdhesive - Adhesive one side, no adhesiveStandard thickness - 0.006"Custom made configurations available upon request

• Thermal impedance 0.49°C-in2/W (@50 psi)
• Medium performance film
• Less sensitive to clamping pressure because of its smooth surface finish
• Physically strong dielectric barrier against cut-through

Dielectric Breakdown Voltage	6000.0 Vac
Dielectric Constant, @ 1kHz	4.0
Flame Rating	V-0
Operating Temperature	-60.0 - 180.0 °C
Shore Hardness, ASTM D2240 Shore A	90.0
Standard Thickness	0.152 mm
Thermal Conductivity	1.1 W/mK
Thermal Impedance, ASTM D5470 @ 50 psi	0.49 °C-in²/W
Volume Resistivity	1×10 Ohm m