BERGQUIST SIL PAD TSP Q2000 Így ismerik: Q-Pad® 3

BERGQUIST SIL PAD TSP Q2000, Fiberglass-Reinforced, Silicone based, Grease Replacement Thermal Interface BERGQUIST® SIL PAD TSP Q2000 eliminates problems associated with thermal grease such as contamination of electronic assemblies and reflow solder baths. BERGQUIST SIL PAD TSP Q2000 may be installed prior to soldering and cleaning without worry. When clamped between two surfaces, the elastomer conforms to surface textures thereby creating and air-free interface between heat-generating components and heat sinks. Fiberglass reinforcement enables BERGQUIST SIL PAD TSP Q2000 to withstand processing stresses without losing physical integrity. It also provides ease of handling during application.

• Thermal impedance: 0.35°C-in2/W (@50 psi)
• Eliminates processing constraints typically associated with grease
• Easy handling
• Conforms to surface textures

Carrier Type	Fiberglass
Color	Black
Flame Rating	V-0
Operating Temperature	-60.0 - 180.0 °C
Technology	Silicone
Thermal Conductivity	0.2 W/mK