LOCTITE ABLESTIK 8008MD Így ismerik: ABLECOAT 8008MD

LOCTITE ABLESTIK 8008MD, Proprietary Hybrid Chemistry, Die Attach LOCTITE® ABLESTIK 8008MD adhesive is designed for medium die attach applications. This material can be applied to a wafer backside by stencil printing and then B-staged in an oven. The adhesive can then be cured after die attach in an in-line process. This material was originally released as RP-825-3C1.

• Electrically conductive
• Thermally conductive
• Low modulus
• Good substrate wetting

Applications	Die Attach
Cure Type	Heat Cure
Extractable Ionic Content, Chloride (CI-)	9.0 ppm
Extractable Ionic Content, Potassium (K+)	9.0 ppm
Extractable Ionic Content, Sodium (Na+)	9.0 ppm
Hot Die Shear Strength	2.7 kg-f
Storage Temperature	-40.0 °C
Tensile Modulus, DMTA @ 250.0 °C	440.0 N/mm² (63820.0 psi )