LOCTITE ABLESTIK 8200C

LOCTITE ABLESTIK 8200C, Proprietary Hybrid Chemistry, Die Attach, Electrically Conductive Adhesive LOCTITE® ABLESTIK 8200C electrically conductive die attach adhesive is designed for high reliability package applications with medium thermal and electrical requirements. This material offers improved JEDEC performance on QFN type packages.

• Improved MRT on Ag plated LF
• High electrical conductivity
• Low bleed
• Snap curable

Applications	Die Attach
Coefficient of Thermal Expansion (CTE)	60.0 ppm/°C
Coefficient of Thermal Expansion (CTE), Above Tg	130.0 ppm/°C
Color	Silver
Cure Schedule, @ 175.0 °C 30 min. ramp	45.0 min.
Cure Type	Heat Cure
Extractable Ionic Content, Chloride (CI-)	9.0 ppm
Extractable Ionic Content, Potassium (K+)	9.0 ppm
Extractable Ionic Content, Sodium (Na+)	9.0 ppm
Glass Transition Temperature (Tg)	190.0 °C
RT Die Shear Strength, 3 x 3 mm Si die on SPCLF	19.1 kg-f
Tensile Modulus, DMTA @ 250.0 °C	759.0 N/mm² (110000.0 psi )
Thermal Conductivity	1.2 W/mK
Thixotropic Index	5.0
Viscosity, Brookfield CP51, @ 25.0 °C Speed 5 rpm	11500.0 mPa·s (cP)
Volume Resistivity	0.00017 Ohm cm