LOCTITE ABLESTIK 8380

LOCTITE ABLESTIK 8380, Epoxy, Die Attach, Electrically Conductive Adhesive LOCTITE® ABLESTIK 8380 electrically conductive adhesive is designed for advanced, high volume, reel-to-reel smart card applications. This adhesive is specially formulated to increase assembly productivity and yield. The rheology of LOCTITE ABLESTIK 8380 adhesive allows minimum adhesive dispense and die put down dwell times, without tailing or stringing problems. It is ideal for high speed automated die bonders. The adhesive can be dispensed with minimum dwell time, without tailing or stringing, to maximize die bonder UPH. Please refer to the TDS for alternate cure schedules.

• Reduced tailing and stringing
• Electrically conductive

Applications	Die Attach
Coefficient of Thermal Expansion (CTE)	56.0 ppm/°C
Cure Type	Heat Cure
Extractable Ionic Content, Chloride (CI-)	100.0 ppm
Extractable Ionic Content, Potassium (K+)	10.0 ppm
Extractable Ionic Content, Sodium (Na+)	10.0 ppm
RT Die Shear Strength, 2 x 2 mm Si die on silver plated copper leadframe	13.5 kg-f