BERGQUIST GAP FILLER TGF 1000 Így ismerik: Gap Filler 1000

BERGQUIST GAP FILLER TGF 1000 is a silicone based, thermally conductive and form in place gap filler ideal for fragile and low stress applications. BERGQUIST® GAP FILLER TGF 1000 is a two component, thermally conductive, silicone based liquid gap filler. It can be cured at room temperature and the curing process can be accelerated with heat. This product exhibits low modulus and good compression set. It also exhibits excellent low and high temperature mechanical and chemical stability and hence is fit for use over a wide range of temperatures.

• Thermal conductivity: 1 W/m-K
• Room temperature as well as accelerated curing possible
• Operating temperature from -60 to 175°C
• UL94 V-0 compliance

Cure Schedule, @ 100.0 °C	5.0 min.
Cure Schedule, @ 25.0 °C	60.0 - 120.0 min.
Density	1.6 g/cm³
Dielectric Constant, @ 1kHz	5.0
Flame Rating	V-0
Heat Capacity, ASTM E1269	1.0 J/g-K
Mix Ratio, by Volume	1 : 1
Mix Ratio, by Weight	1 : 1
Pot Life, @ 25.0 °C	15.0 min.
Shelf Life	6.0 mon.
Shore Hardness, Thirty second delay value, ASTM D2240 Shore 00	30.0
Storage Temperature	25.0 °C
Thermal Conductivity	1.0 W/mK
Volume Resistivity	1×10 Ohm m
Resin
Color, Resin	Gray
Hardener
Color, Hardener	White