BERGQUIST GAP FILLER TGF 1100SF Így ismerik: Gap Filler 1100SF

BERGQUIST GAP FILLER TGF 1100SF is a silicone free (SF), high-performance gap filler ideal for fragile and low stress applications. BERGQUIST® GAP FILLER TGF 1100SF is a two component, thermally conductive, silicone free liquid gap filler. It can be cured at room temperature and the curing process can be accelerated with heat. It helps reduce thermal stresses during operation.

• Thermal conductivity: 1.1 W/m-k
• Silicone free
• Room temperature as well as accelerated curing possible
• UL94 V-0 compliance

Cure Schedule, Recommended @ 25.0 °C	24.0 hr.
Density	2.0 g/cm³
Dielectric Constant, @ 1kHz	5.0
Flame Rating	V-0
Heat Capacity, ASTM E1269	0.9 J/g-K
Mix Ratio, by Volume	1 : 1
Mix Ratio, by Weight	1 : 1
Pot Life, @ 25.0 °C	4.0 hr.
Shelf Life	6.0 mon.
Shore Hardness, Thirty second delay value, ASTM D2240 Shore 00	60.0
Storage Temperature	25.0 °C
Thermal Conductivity	1.1 W/mK
Volume Resistivity	1×10 Ohm m
Resin
Color, Resin	Yellow
Hardener
Color, Hardener	Red