BERGQUIST GAP FILLER TGF 3000SF

BERGQUIST GAP FILLER TGF 3000SF is a 2-part silicone-free, room temperature curable gap filler designed for use in high throughput assembly applications. BERGQUIST GAP FILLER TGF 3000SF is a 2-part silicone-free gap filler that is curable at room temperature and is suitable for use in high throughput assembly applications. With a 3.0 W/m-K thermal performance, it provides an excellent solution in the assembly of high-performance power devices.

• Thermal Conductivity: 3.0 W/m-K
• Dispensable liquid, 2K Silicone free Gap Filler
• Room temperature cure - no oven required
• Low compression stress during assembly