BERGQUIST GAP PAD TGP 10000ULM

BERGQUIST GAP PAD TGP 10000ULM is a soft gap pad filler with ultra low modulus (ULM) and exceptional thermal conductivity of 10.0W/m-K. BERGQUIST® GAP PAD TGP 10000ULM is designed for high performance applications and provides excellent wet-out at the interface characteristics due to its exceptional conformity to rough or irregular surfaces. The soft gap pad filler material is supplied with a protective liner on both sides for ease of use, and the unique filler package and low modulus design offers high thermal performance at low pressures.

• Thermal conductivity: 10 W/m-K
• Ultra-low modulus design easily conforms and adheres to irregular surfaces
• Low compression stress
• High-compliance

Color	Gray
Operating Temperature	-60.0 - 200.0 °C
Technology	Silicone
Thermal Conductivity	10.0 W/mK