BERGQUIST GAP PAD TGP 1000VOUSB Így ismerik: Gap Pad® VO Ultra Soft-B

BERGQUIST GAP PAD TGP 1000VOUSB, Ultra Conformable, Viscoelastic, Electrically isolating, Thermally Conductive Material for Filling Air Gaps BERGQUIST® GAP PAD TGP 1000VOUSB is recommended for applications that require a minimum amount of pressure on components. The viscoelastic nature of the material also gives excellent low-stress vibration dampening and shock absorbing characteristics. BERGQUIST GAP PAD TGP 1000VOUSB is an electrically isolating material, which allows its use in applications requiring isolation between heat sinks and high-voltage, bare-leaded devices.

• Thermal conductivity: 1.0 W/m-K
• Highly conformable, low hardness
• Decreased strain
• Puncture, shear and tear resistant

Carrier Type	Fiberglass
Color	Black
Operating Temperature	-60.0 - 200.0 °C
Standard Thickness	0.508 - 3.175 mm
Technology	Silicone
Thermal Conductivity	1.0 W/mK
Young's Modulus, ASTM D575	55.0 KPa (8.0 psi )