BERGQUIST GAP PAD TGP 1300U Így ismerik: Gap Pad® VO Ultimate

BERGQUIST GAP PAD TGP 1300U, Ultra Conformability, Robust, Improved Thermal Conductivity, Gap Filling Material BERGQUIST® GAP PAD TGP 1300U is a robust, highly compliant product that is ideal for both small and large gap designs. The fiberglass carrier on one side of the material allows ease of rework, excellent handling characteristics and puncture resistance. Additionally the fiberglass carrier has a slight inherent tack, minimizing any shifting during assembly. The conformable and elastic nature of BERGQUIST GAP PAD TGP 1300U allows excellent interfacing and wet-out characteristics, even to surfaces with a high degree of roughness or uneven topography. The construction of BERGQUIST GAP PAD TGP 1300U one side has high inherent tack, while the other side has minimal tack. This combination is useful for manual and automated processes.

• Ultra conformability
• Thermal Conductivity: 1.3 W/m-K
• “Gel-like” modulus
• Excellent rebound

Carrier Type	Fiberglass
Color	Gray
Operating Temperature	-60.0 - 200.0 °C
Standard Thickness	0.508 - 3.175 mm
Technology	Silicone
Thermal Conductivity	1.3 W/mK
Young's Modulus, ASTM D575	90.0 KPa (13.0 psi )