BERGQUIST GAP PAD TGP 2101SF Így ismerik: Gap Pad® 2101SF

BERGQUIST GAP PAD TGP 2101SF, Thermally Conductive, Silicone-Free Gap Filling Material BERGQUIST® GAP PAD TGP 2101SF is a silicone-free, high performance, thermally conductive gap filling material. The material offers high thermal performance (2.0 W/mK) and is designed for silicone-sensitive applications. BERGQUIST GAP PAD TGP 2101SF is reinforced for easy material handling and added durability during assembly. BERGQUIST GAP PAD TGP 2101SF offers exceptionally low interfacial resistances to adjacent surfaces and is constructed using a 1 mil polyester film on one side and natural tack on the other . The 1 mil polyester film provides a tack-free surface that can be utilized to slide the pad or component into position during assembly.

• Thermal Conductivity: 2.0 W/m-K
• No silicone outgassing
• No silicone extraction
• Tack on one side for easy handling

Carrier Type	Polyester
Color	Green
Operating Temperature	-60.0 - 125.0 °C
Standard Thickness	0.254 - 3.175 mm
Technology	Silicone
Thermal Conductivity	2.0 W/mK
Young's Modulus, ASTM D575	228.0 KPa (33.0 psi )