BERGQUIST GAP PAD TGP 2202SF Így ismerik: Gap Pad® 2202SF

BERGQUIST GAP PAD TGP 2202SF is a silicone-free, thermally conductive gap filler material that features a 0.5 mil PET coating on one side and natural tack on the other to eliminate the need for additional adhesive layers. BERGQUIST® GAP PAD TGP 2202SF is a high-performance gap filling material with a fiberglass center which provides exceptionally low interfacial resistances to adjacent surfaces and its silicone-free design is compatible with silicone-sensitive applications. BERGQUIST GAP PAD TGP 2202SF is available in a variety of sizes and thicknesses. Custom-made configurations are available upon request.

• Thermal conductivity: 2.0 W/m-K
• Silicone-free formulation
• 0.5 mil film provides tack-free surface
• Minimal compression set

Color	Gray
Density	2.8 g/cm³
Dielectric Constant, @ 1kHz	6.0
Flame Rating	V-0
Operating Temperature	-40.0 - 125.0 °C
Shore Hardness, Thirty second delay value, ASTM D2240 Bulk Rubber @ 23.0 °C Shore 00	70.0
Standard Thickness	0.254 - 3.175 mm
Thermal Conductivity	2.0 W/mK
Volume Resistivity	1×10 Ohm m