BERGQUIST GAP PAD TGP 3500ULM Így ismerik: Gap Pad® 3500ULM
BERGQUIST GAP PAD TGP 3500ULM is a gray, silicone thermal interface gap pad material designed for high performance applications that require extremely low assembly stress.
BERGQUIST® GAP PAD TGP 3500ULM is an ultra-conforming, thermally conductive material that is offered in two different options: fiberglass reinforced for shear and tear resistance as well as a non-fiberglass option for applications that require reduced stress. The extremely soft gap filling material offers exceptional thermal performance at low temperatures and is well suited for high performance applications.
- Thermal conductivity: 3.5 W/m-K
- Fiberglass reinforced for puncture, shear, and tear resistance
- Highly conformable and maintains structure integrity with extremely low compression stress
- Non-fiberglass option for reduced stress required in application
Carrier Type |
Fiberglass, Non-fiberglass |
Color |
Gray |
Flame Rating |
V-0 |
Operating Temperature |
-60.0 - 200.0 °C |
Standard Thickness |
0.508 - 3.175 mm |
Technology |
Silicone |
Thermal Conductivity |
3.5 W/mK |
Young's Modulus |
27.5 KPa (4.0 psi ) |