BERGQUIST GAP PAD TGP 6000ULM

BERGQUIST GAP PAD TGP 6000ULM is a high performance, silicone-based, ultra low modulus (ULM) gap pad filler with a thermal conductivity rating of 6.0 W/m-K. BERGQUIST® GAP PAD TGP 6000ULM is an extremely soft, thermal interface material with a higher natural tack, thereby eliminating the need for additional adhesive layers and provides stick-in-place characteristics during assembly. The specially designed formulation offers excellent thermal performance at low pressures and is highly conforming, allowing for excellent wet-out at the interface.

• Thermal conductivity: 6 W/m-K
• Excellent interfacing and wet-out characteristics
• Supplied with protective liners for ease of use
• UL94 V-0 compliance

Carrier Type	Fiberglass
Color	Gray
Operating Temperature	-60.0 - 200.0 °C
Standard Thickness	1.524 - 3.175 mm
Technology	Silicone