BERGQUIST GAP PAD TGP 7000ULM

BERGQUIST GAP PAD TGP 7000ULM is a thermally conductive, soft gap pad filler designed for high performance applications. BERGQUIST® GAP PAD TGP 7000ULM is an extremely soft and flexible material with a thermal conductivity rating of 7.0 W/m-K. The specially designed formulation offers exceptional thermal performance pressures due to using a unique filler package and ultra low modulus resin. This allows the material to be highly conforming to rough or irregular surfaces, providing excellent wet-out at the interface.

• Thermal conductivity: 7 W/m-K
• Ultra low modulus
• High-compliance
• Low compression stress

Color	Gray
Flame Rating	V-0
Operating Temperature	-60.0 - 200.0 °C
Standard Thickness	0.5 - 3.18 mm
Technology	Silicone